AM1802 datasheet(90/180 Pages) TI1

90 / 180 page

OFFSET

RecommendedDDR2/mDDR

DeviceOrientation

OFFSET

DDR2/mDDR

Device

AM1802

SPRS710C – NOVEMBER 2010 – REVISED MARCH 2012

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5.11.3.4 Placement

Figure 5-17 shows the required placement for the device as well as the DDR2/mDDR devices. The

dimensions for Figure 5-18 are defined in Table 5-28. The placement does not restrict the side of the PCB

that the devices are mounted on. The ultimate purpose of the placement is to limit the maximum trace

lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the second

DDR2/mDDR device is omitted from the placement.

Figure 5-18. Device and DDR2/mDDR Device Placement

Table 5-28. Placement Specifications(1)(2)

NO.

PARAMETER

MIN

MAX

UNIT

1750

Mils

1280

Mils

Y Offset

(3)650

Mils

Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region(4)

w(5)

(1)

See Figure 5-18 for dimension definitions.

(2)

Measurements from center of device to center of DDR2/mDDR device.

(3)

For single memory systems it is recommended that Y Offset be as small as possible.

(4)

Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by

a ground plane.

(5)

w = PCB trace width as defined in Table 5-27.

Peripheral Information and Electrical Specifications

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