R262 datasheet(25/28 Pages) ONSEMI

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BelaSigna R262

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hardware setup (for custom configuration of the various

hardware units like clocking, input/output stages),

algorithm setup (amplitude management, tuning selection)

and finally the low

*level I2C protocol is also supported.

The I2C interface can also be used to communicate with

a slave I2C EEPROM. Using an I2C EEPROM instead of an

SPI EEPROM provides better flexibility as it avoids

potential conflicts between GPIO/LSAD pins and the SPI

pins. More details on this command interface can be found

in the BelaSigna R262 Communications and Configuration

Guide.

Interfaces Unused by the ROM−based Application

BelaSigna R262 also contains hardware provisions for a

high speed PCM interface, as well as a high speed UART.

These two interfaces are not used by the ROM−based

application, hence cannot be used by default. Custom

applications developed by ON Semiconductor could enable

the use of these interfaces, should this be required.

Long Term Storage Conditions

ON Semiconductor specifies a 24−month maximum

storage time for WLCSP devices in pocket tapes and

conditioned in dry bags, as stated in Table 15 below and

defined in ON Semiconductor’s Finished Goods Packing

and Long Term Storage Procedures.

Table 15. LONG TERM STORAGE CONDITIONS

Storage Condition

Maximum Storage Time

Remarks

Temperature 18−28°C,

Humidity 30−65%RH

24 months after die

singulation/sawing date

Maximum 12 months storage at condition 18−28°C, 30−65%RH. After-

wards storage in vacuum moisture bag with desiccant and humidity card.

Storage in nitrogen cabinet allowed.

Re−Flow Information

The re−flow profile depends on the equipment that is used

for the re−flow and the assembly that is being re−flowed.

Careful design consideration must be taken not to expose the

packages to temperatures above the rated features. The

WLCSP package is tested to perform reliably up to 3x reflow

passes at the maximum reflow peak temperature of 260

°C.

Use Table 16 from the JEDEC Standard 22−A113D and

J−STD−020D as a guideline but note that actual profiles

should be developed by customers based on specific process

needs and board designs.

Table 16. RE−FLOW INFORMATION

Profile Feature

Pb−free Assembly

Preheat & Soak

Temperature minimum (TSMIN)

Temperature maximum (TSMAX)

Time (TSMIN to TSMAC) (TS)

150°C

200°C

60−120 seconds

Average Ramp−Up Rate

(TSMAX to TP)

3°C/second maximum

Liquidous temperature and time

Temperature (TL)

Time (tL)

217°C

60−150 seconds

Peak Temperature (TP)

260 +0/−5°C

Time within 5°C of Actual Peak

Temperature

20−40 seconds

Ramp−Down Rate (TP to TSMAX)

6°C/second maximum

Time 25°C to Peak Temperature

8 minutes maximum

Device Weight

BelaSigna R262 has an average weight of 10.84 mg.

Miscellaneous

Chip Identification

Chip identification information can be retrieved by using

the Communications Accelerator Adaptor (CAA) along

with protocol software provided by ON Semiconductor. For

BelaSigna R262, the key identifier components and values

are as follows:

Chip Family

Chip Version

0x02 (SK2)

0x3021

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