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R262 Datasheet(PDF) 28 Page - ON Semiconductor |
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R262 Datasheet(HTML) 28 Page - ON Semiconductor |
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28 / 28 page ![]() BelaSigna R262 http://onsemi.com 28 Assembly / Design Notes For PCB manufacture with BelaSigna R262, ON Semiconductor recommends solder−on−pad (SoP) surface finish. With SoP, the solder mask opening should be non−solder mask−defined (NSMD) and copper pad geometry will be dictated by the PCB vendor’s design requirements. Alternative surface finishes are ENiG and OSP; volume of screened solder paste (#5) should be less than 0.0008 mm3. If no pre−screening of solder paste is used, then the following conditions must be met: 1. The solder mask opening should be >0.3 mm in diameter 2. The copper pad should have a diameter of 0.25 mm 3. Solder mask thickness should be less than 1 mil thick above the copper surface For PCB manufacture with the 26−ball WLCSP version of BelaSigna R262, any vias that might be placed below the WLCSP should all be covered in soldermask. The assembly process can use underfill under the WLCSP; it will provide another physical dielectric barrier, and will also enhance long term reliability over temperature and physical shock. ON Semiconductor can provide BelaSigna R262 mounting footprint guidelines to assist your PCB design upon request. Table 17. ORDERING INFORMATION Device Marking Package Shipping † BR262W30A103E1G BR262W30 WLCSP30 2500 / Tape & Reel BR262W26A103E1G BR262W26 WLCSP26 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 BR262/D BELASIGNA is a registered trademark of Semiconductor Components Industries, LLC. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative |
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