| Electronic Components Datasheet Search |
|
R262 Datasheet(PDF) 27 Page - ON Semiconductor |
|
|
|||||||||||||||||||||||||||||
R262 Datasheet(HTML) 27 Page - ON Semiconductor |
|
27 / 28 page ![]() BelaSigna R262 http://onsemi.com 27 PACKAGE DIMENSIONS WLCSP26, 2.388x2.233 CASE 567CY−01 ISSUE A SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 2X DIM A MIN MAX 0.84 MILLIMETERS A1 D 2.388 BSC E b 0.24 0.29 eD 0.252 BSC 1.00 D E A B PIN A1 REFERENCE eD A 0.05 B C 0.03 C 0.05 C 26X b 12 3 A B C 0.10 C A A1 A2 C 0.17 0.23 2.233 BSC eE 0.310 BSC PITCH 0.25 26X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.504 0.31 0.10 C 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 eE A2 0.72 REF RECOMMENDED A1 PACKAGE OUTLINE 45 6 78 9 D E F G |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |