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AD6426 Datasheet(PDF) 32 Page - Analog Devices |
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AD6426 Datasheet(HTML) 32 Page - Analog Devices |
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32 / 50 page ![]() Preliminary Technical Information AD6426 This Information applies to a product under development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no obligation regarding future manufacture unless otherwise agreed to in writing. No responsibility is assumed by Analog Devices for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Revision Preliminary 2.3 (June 9, ´98) - 32 - Confidential Information SPECIFICATIONS General Parameter Min Typ Max Units Comments TA , Ambient Operating Temperature -25 +85 °C VDD , Supply Voltage 2.4 3.3 Volt IDD , Supply Current (Idle Mode) TBD mA @ VDD = 3.0 V IDD , Supply Current (Talk Mode) TBD mA @ VDD = 3.0 V fCLKIN , Clock Input Frequency 13 MHz VCLKIN , Clock Input Voltage 0.250 VPP sine wave, ac-coupled RCLKIN, Clock Input Resistance (see Note) 19.5 k Ω sine wave, ac-coupled Logic Inputs VIH , Input High Voltage VDD - 0.8 Volt VIL , Input Low Voltage 0.8 Volt IIH , IIL Input Current -10 10 µA CIN , Input Capacitance TBD pF Logic Outputs VOH , Output High Voltage VDD - 0.4 VOL , Output Low Voltage 0.4 IOZL , Low Level Output 3-State Leakage Current -10 10 µA IOZH , High Level Output 3-State Leakage Current -10 10 µA Note: The input impedance of the clock buffer is a function of the voltage and waveform of the clock input signal. For sinusoidal input signals the typical input impedance can be calculated by: RIN [k Ω] = V CLKIN [VPP] × 78 ABSOLUTE MAXIMUM RATINGS VDD to GND ............................................. -0.3V to + TBD V Digital I/O Voltage to GND ................... -0.3V to VDD + 0.3V Operating Temperature Range ........................ -25°C to +85°C LQFP Package Storage Temperature Range .......................... -65°C to +150°C Maximum Junction Temperature ................................ +150°C QJA Thermal Impedance..............................................28°C/W Lead temperature, Soldering Vapor Phase (60 sec)........................................... +215°C Infrared (15 sec).................................................. +220°C PBGA Package Storage Temperature Range .......................... -65°C to +150°C Maximum Junction Temperature ................................ +150°C QJA Thermal Impedance..............................................30°C/W Lead temperature, Soldering Vapor Phase (60 sec)........................................... +215°C Infrared (15 sec).................................................. +220°C Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TA= +25°C unless otherwise stated. ESD SUSCEPTIBILITY ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 volts, which readily accumulate on the human body and on test equipment, can discharge without detection. Although this device features proprietary ESD protection circuitry, permanent damage may still occur on this device if it is subjected to high energy electrostatic discharges. Therefore, proper precautions are recommended to avoid any performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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