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UPD78014 Datasheet(PDF) 4 Page - Renesas Technology Corp |
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UPD78014 Datasheet(HTML) 4 Page - Renesas Technology Corp |
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4 / 58 page  2 µPD78P083 ORDERING INFORMATION Part Number Package Internal ROM µPD78P083CU 42-pin plastic shrink DIP (600 mil) One-Time PROM µPD78P083GB-3B4 44-pin plastic QFP (10 x 10 mm) One-Time PROM µPD78P083GB-3BS-MTX 44-pin plastic QFP (10 x 10 mm) One-Time PROM µPD78P083DU 42-pin ceramic shrink DIP EPROM (with window) (600 mil) Caution µPD78P083GB has two kinds of package. (Refer to 9. PACKAGE DRAWINGS). Please refer an NEC’s sales representative for the available package. QUALITY GRADE Part Number Package Quality Grades µPD78P083CU 42-pin plastic shrink DIP (600 mil) Standard µPD78P083GB-3B4 44-pin plastic QFP (10 x 10 mm) Standard µPD78P083GB-3BS-MTX 44-pin plastic QFP (10 x 10 mm) Standard µPD78P083DU 42-pin ceramic shrink DIP Not applicable (with window) (600 mil) Please refer to “Quality grades on NEC Semiconductor Devices” (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. * |
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