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AN1172 Datasheet(PDF) 17 Page - STMicroelectronics |
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AN1172 Datasheet(HTML) 17 Page - STMicroelectronics |
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17 / 23 page ![]() AN1172 ESD diode conduction due to kick-back 17/23 Appendix B ESD diode conduction due to kick-back An over-voltage can appear across the gate and COM (or A1 for triacs) terminals at high turn-on di/dt rates. This effect is called the "kick-back". It is due to the high density current at turn-on which causes high conduction voltage drop. Since the conduction begins around the gate area, the forward voltage is in part applied to the gate. This gate spike is clamped by the micro-controller internal electrostatic discharge (ESD) diodes, which can be damaged if conduction lasts for too long. In order to prevent ESD diodes conduction, their voltage must remain negative. When considering Figure 1. at ACS turn-on, i.e. when the push transistor M1 is off and the pull transistor M2 is on, a circulating current will never occur through D2 if the current iR remains positive. This yields Equation B1. Equation B1 As M2 is conducting, its voltage drop can be neglected. Thus, the previous relation gives: Equation B2 If D1 conducts, this means that the supply voltage is held by M2, neglecting D1 drop voltage. This MOS transistor is thus in a linear mode. Its current equals its saturating level, called isat. Now, since isat current is necessarily higher than the Vs/R ratio (in order to secure the micro- controller operation), we can write the following relationship : Equation B3 A sufficient condition to ensure that VD1 remains below zero is that Vg remains below Vs. This condition, plus Equation B2, gives the following safety rule for no ESD diode conduction: Equation B4 0 V V V i R g S 2 M R > + + - = ⋅ S g V V- > S g sat g 1 D V V i R V V- < ⋅ - = S g S V V V+ < < - |
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