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AN1172 Datasheet(PDF) 20 Page - STMicroelectronics

Part # AN1172
Description  A logic-level transient-voltage protected AC switch
PDF  23 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN1172 Datasheet(HTML) 20 Page - STMicroelectronics

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How to calculate the junction temperature during clamping periods
AN1172
20/23
Figure 22.
Current waveform during clamping phase for 100mA / 230V RMS loads
Considering Figure 22., we can see that the load current is always inferior to a linearly
decreasing current beginning at (iH, t0) point and ending at (0, tZC). Furthermore, the
temperature elevation due to a rectangular power pulse is always superior to the one due to
a decreasing triangular power pulse of same average value (see References, 3.).
So, a pessimistic way to calculate the junction temperature is to simplify the clamping losses
shape by a constant power pulse of Vcl.IH/2 value and tZC-t0 time long. The energy absorbed
by the die during a clamping event (ECL) depends on two ACS parameters (Vcl and IH) and
on the clamping duration:
Equation C3
C.2
Transient maximum junction temperature
The clamping time is given by Equation C1, which gives way to the following one.
Equation C4
Neglecting the on-state dissipated power in front of clamping dissipated power, the junction
temperature rise at the end of the clamping phase is:
Equation C5
50
40
30
20
10
0
9
9.1
9.2
cos
= 0.9
ϕ
cos
= 0.1
ϕ
cos
= 0.7
ϕ
9.3
9.4
9.5
9.6
Time (ms)
t0
IH
tZC
()
0
ZC
H
cl
CL
t
t
I
V
2
1
E-
=
-
+
+
-
H
cl
0
ZC
i
Vac
E
V
R
1
ln
R
L
t
t
H
cl
0
ZC
j
I
V
2
1
)
t
t
(
Zth
T
-
=



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