LM3559 datasheet(4/50 Pages) TI1

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LM3559

SNVS624B – JUNE 2011 – REVISED JUNE 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and

disengages at TJ = 135°C (typical). Thermal shutdown is ensured by design.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

–0.3

VSCL, VSDA, VHWEN, VSTROBE, VTX1, VTX2, VLED1, VLED2, VLEDI/NTC

–0.3

to the lesser of (VIN + 0.3

V) with 6 V maximum

VSW, VOUT

–0.3

Continuous power dissipation(2)

Internally limited

Junction temperature, TJ-MAX

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage, VIN

2.5

5.5

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

(1)

–40

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines

set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm × 76 mm × 1.6 mm with a 2 × 1

array of thermal vias. The ground plane on the board is 50 mm × 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm

(1.5 oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1 W.

6.4 Thermal Information

THERMAL METRIC(1)

LM3559

UNIT

YZR (DSBGA)

16 PINS

RθJA

Junction-to-ambient thermal resistance(2)

71.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

18.4

°C/W

RθJB

Junction-to-board thermal resistance

9.8

°C/W

ψJT

Junction-to-top characterization parameter

1.7

°C/W

ψJB

Junction-to-board characterization parameter

1.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

9.7

°C/W

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