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SLMA002 Datasheet(PDF) 27 Page - Texas Instruments |
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SLMA002 Datasheet(HTML) 27 Page - Texas Instruments |
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27 / 46 page ![]() 2 D(cond) RMS(outputx) DS(on) P I R = ´ (17) 2 P D(SW) = (V ) C f IN J S 2 ´ ´ (18) D D(cond)output1 D(SW )output1 D(cond)output2 D(SW )output2 IN P P P P P V Iq = + + + + ´ (19) ( ) J A D TH(pkg) TH(pad amb) T T P - = + ´ q + q (20) Power Derating TPS55383 ,, TPS55386 www.ti.com ......................................................................................................................................................................................... SLUS818 – SEPTEMBER 2008 Notice the impact of the operating duty cycle on the result. Multiplying the result by the RDS(on) of the MOSFET gives the conduction loss. The switching loss is approximated by: where • where C J is the prallel capacitance of the rectifier diode and snubber (if any) • f S is the switching frequency The total power dissipation is found by summing the power loss for both MOSFETs plus the loss in the internal regulator. The temperature rise of the device junction depends on the thermal impedance from junction to the mounting pad (See the Package Dissipation Ratings table), plus the thermal impedance from the thermal pad to ambient. The thermal impedance from the thermal pad to ambient depends on the PCB layout (PowerPAD interface to the PCB, the exposed pad area) and airflow (if any). See the PCB Layout Guidelines, Additional References section. The operating junction temperature is shown in Equation 20. The TPS5538x delivers full current at ambient temperatures up to +85°C if the thermal impedance from the thermal pad maintains the junction temperature below the thermal shutdown level. At higher ambient temperatures, the device power dissipation must be reduced to maintain the junction temperature at or below the thermal shutdown level. Figure 30 illustrates the power derating for elevated ambient temperature under various airflow conditions. Note that these curves assume that the PowerPAD is properly soldered to the recommended thermal pad. (See the References section for further information.) Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Link(s): TPS55383 TPS55386 |
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