MCP8026 datasheet(22/64 Pages) MICROCHIP

22 / 64 page

MCP8025/6

DS20005339B-page 22

 2016 Microchip Technology Inc.

3.1

Low-Side PWM Inputs

(PWM1L, PWM2L, PWM3L)

Digital PWM inputs for low-side driver control. Each

input has a 47 k

 pull down to ground. The PWM

signals may contain dead-time timing or the system

may use configuration register 2 (CFG2) to set the

dead time.

3.2

High-Side PWM Inputs

(PWM1H, PWM2H, PWM3H)

Digital PWM inputs for high-side driver control. Each

input has a 47 k

 pull down to ground. The PWM

signals may contain dead-time timing or the system

may use the configuration register 2 (CFG2) to set the

dead time.

3.3

No Connect (NC)

Reserved. Do not connect.

3.4

Chip Enable Input (CE)

Chip Enable input is used to enable/disable the output

driver and on-board functions. When CE is high, all

device functions are enabled. When CE is low, the

device operates in Standby or Sleep mode. When

Standby mode is active, the current amplifiers and the

12V LDO are disabled. The buck regulator, the DE2

pin, the voltage and temperature sensor functions are

not affected. The 5V LDO is disabled on the MCP8026.

The H-bridge driver outputs are all set to a low state

within 100 ns of CE = 0. The device transitions to

Standby or Sleep mode 1 ms after CE = 0.

The CE pin may be used to clear any hardware faults.

When a fault occurs, the CE input may be used to clear

the fault by setting the pin low and then high again. The

fault is cleared by the rising edge of the CE signal if the

hardware fault is no longer active.

The CE pin is used to enable Sleep mode when the

SLEEP bit in the CFG0 configuration register is set

to ‘1’. CE must be low for a minimum of 1 ms before the

transition to Standby or Sleep mode occurs. This allows

time for CE to be toggled to clear any faults without

going into Sleep mode.

The CE pin is used to awaken the device from the

Sleep mode state. To awaken the device from a Sleep

mode state, the CE pin must be set low for a minimum

of 250 μs. The device will then wake up with the next

rising edge of the CE pin.

The CE pin has an internal 47 k

 pull down.

3.5

Level Translators (HV_IN1,

HV_IN2, LV_OUT1, LV_OUT2)

Unidirectional digital level translators. These pins

translate digital input signal on the HV_INx pin to a

low-level digital output signal on the LV_OUTx pin. The

HV_INx pins have internal 30 k

 pull ups to VDD that

are controlled by bit PU30K in the CFG0 configuration

The HV_IN1 pin has higher ESD protection than the

HV_IN2 pin. The higher ESD protection makes the

HV_IN1 pin better suited for connection to external

switches.

LV_OUT1 and LV_OUT2 are open-drain outputs. An

external pull-up resistor to the low-voltage logic supply

is required.

The HV_IN1 pin may be used to awaken the device

from the Sleep mode state. The MCP8026 will awaken

on the rising edge of the pin after detecting a low state

lasting > 250 µs on the pin.

3.6

LIN Transceiver Bus (LIN_BUS)

The bidirectional LIN_BUS interface pin connects to

the LIN Bus network. The LIN_BUS driver is controlled

by the TX pin. The driver is an open-drain output. The

MCP8025 device contains a LIN Bus 30 k

 pull-up

resistor that may be enabled or disabled by setting the

PU30K bit in the CFG0 configuration register. The pull

up may only be changed while in Standby mode.

During normal operation, the 30 k

 pull up is always

enabled. In Sleep mode, the 30 k

 pull up is always

disabled.

The LIN bus may be used to awaken the device from

the Sleep mode state. When a LIN wake-up event is

detected on the LIN_BUS pin, the device will wake up.

The MCP8025 will awaken on the rising edge of the

bus after detecting a dominant state lasting > 150 µs

on the bus. The LIN Bus master must provide the

dominant state for > 250 µs to meet the LIN 2.2A

specifications.

3.7

Power Ground (PGND),

Exposed Pad (EP)

Device ground. The PCB ground traces should be short

and wide and should form a STAR pattern to the power

source. The Exposed Pad (EP) must be soldered to the

PCB. The PCB area below the EP should be a copper

pour with thermal vias to help transfer heat away from

the device.

3.8

LIN Transceiver Received Data

Output (RX)

The RX output pin follows the state of the LIN_BUS pin.

The data received from the LIN bus is output on the RX

pin for connection to a host MCU.

The RX pin is an open-drain output.

MCP8026 Datasheet(PDF) 22 Page - Microchip Technology

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