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LAN89218 Datasheet(PDF) 141 Page - Microchip Technology |
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LAN89218 Datasheet(HTML) 141 Page - Microchip Technology |
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141 / 148 page ![]() 2008-2015 Microchip Technology Inc. DS60001255B-page 141 LAN89218 RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.50 BSC MIN E MAX 15.40 Contact Pad Length (X100) Contact Pad Width (X100) Y X 1.50 0.30 Microchip Technology Drawing C04-2233A NOM 100-Lead Low Profile Quad Flatpack (PL) - 14x14 mm Body [LQFP] SILK SCREEN 1 2 100 C1 Contact Pad Spacing 15.40 Space Between Pads G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C1 C2 X E Y G 3 |
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