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LAN89218 Datasheet(PDF) 140 Page - Microchip Technology |
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LAN89218 Datasheet(HTML) 140 Page - Microchip Technology |
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140 / 148 page ![]() LAN89218 DS60001255B-page 140 2008-2015 Microchip Technology Inc. Microchip Technology Drawing C04-233A Sheet 2 of 2 Number of Leads Overall Height Lead Width Lead Length Molded Package Thickness Pitch Standoff Units Dimension Limits A1 A b E D1 E1 A2 e L D N 0.50 BSC 0.45 0.17 - 0.05 0.22 0.60 14.00 BSC - - 16.00 BSC MILLIMETERS MIN NOM 100 0.75 0.27 1.60 0.15 MAX 3.5° 0° 7° REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Lead Angle 100-Lead Low Profile Quad Flatpack (PL) - 14x14 mm Body [LQFP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: L (L1) R R c H DETAIL A Footprint (L1) 1.00 REF Mold Draft Angle 11° 12° 13° 1.35 - 1.45 Overall Width Overall Length Molded Package Width Molded Package Length 14.00 BSC 16.00 BSC Lead Thickness c 0.09 - 0.20 - 0.08 - Bend Radius R |
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