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70T653MS12BCGI Datasheet(PDF) 12 Page - Integrated Device Technology

Part # 70T653MS12BCGI
Description  HIGH-SPEED 2.5V 512K x 36 ASYNCHRONOUS DUAL-PORT STATIC RAM
PDF  24 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

70T653MS12BCGI Datasheet(HTML) 12 Page - Integrated Device Technology

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IDT70T653M
High-Speed 2.5V 512K x 36 Asynchronous Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
12
Unlike other vendors' Asynchronous Random Access Memories,
the IDT70T653M is capable of performing multiple back-to-back write
operations without having to pulse the R/W, CE, or BEn signals high
during address transitions. This RapidWrite Mode functionality allows
the system designer to achieve optimum back-to-back write cycle
performancewithoutthedifficulttaskofgeneratingnarrowresetpulses
every cycle, simplifying system design and reducing time to market.
DuringthisnewRapidWriteMode,theendofthewritecycleisnow
definedbytheendingaddresstransition,insteadoftheR/WorCEorBEn
transition to the inactive state. R/W, CE, and BEn can be held active
throughout the address transition between write cycles. Care must be
taken to still meet the Write Cycle time (tWC), the time in which the
Addressinputsmustbestable. Inputdatasetupandholdtimes(tDWand
tDH) will now be referenced to the ending address transition. In this
RapidWrite Mode the I/O will remain in the Input mode for the duration
of the operations due to R/W being held low. All standard Write Cycle
specifications must be adhered to. However, tAS and tWR are only
applicable when switching between read and write operations. Also,
therearetwoadditionalconditionsontheAddressInputsthatmustalso
bemettoensurecorrectaddresscontrolledwrites. Thesespecifications,
the Allowable Address Skew (tAAS) and the Address Rise/Fall time
(tARF), must be met to use the RapidWrite Mode. If these conditions are
not met there is the potential for inadvertent write operations at random
intermediate locations as the device transitions between the desired
writeaddresses.
5679 drw 08
tWC
tWC
tWC
tEW
tWP
tWZ
tDH
tDW
tDW
tDW
tOW
tWR
ADDRESS
CE or SEM(6)
BEn
R/
W
DATAIN
DATAOUT
(2)
(5)
(5)
tDH
tDH
(4)
Timing Waveform of Write Cycle No. 3, RapidWrite Mode Write Cycle(1,3)
NOTES:
1. OE = VIL for this timing waveform as shown. OE may equal VIH with same write functionality; I/O would then always be in High-Z state.
2. A write occurs during the overlap (tEW or tWP) of a CE = VIL, BEn = VIL, and a R/W = VIL for memory array writing cycle. The last transition LOW of CE, BEn, and
R/W initiates the write sequence. The first transition HIGH of CE, BEn, and R/W terminates the write sequence.
3. If the CE or SEM = VIL transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state.
4. The timing represented in this cycle can be repeated multiple times to execute sequential RapidWrite Mode writes.
5. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load
(Figure 1).
6. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition. CE = VIL when CE0 = VIL
and CE1 = VIH. CE = VIH when CE0 = VIH and/or CE1 = VIL.
RapidWrite Mode Write Cycle



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