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DRB (S-PDSO-N8)

THERMAL INFORMATION

THERMAL PAD MECHANICAL DATA

Exposed Thermal Pad Dimensions

QFND058

NOTE: All linear dimensions are in millimeters

Bottom View

14

85

4x0,23

2x0,65

4x0,625

NOM

Exposed Thermal Pad

This package incorporates an exposed thermal pad that is designed to be attached directly to an external

heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB

can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly

to a ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer

from the integrated circuit (IC).

For additional information on the Quad Flatpack No-Lead (QFN) package and how to take advantage of its heat

dissipating abilities, refer to Application Report, Quad Flatpack No-Lead Logic Packages, Texas Instruments

Literature No. SCBA017 and Application Report, 56-Pin Quad Flatpack No-Lead Logic Package, Texas

Instruments Literature No. SCEA032. Both documents are available at www.ti.com.

The exposed thermal pad dimensions for this package are shown in the following illustration.

+0,10

0,15

1,50

+0,10

0,15

1,75