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AM3351 Datasheet(PDF) 174 Page - Texas Instruments |
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AM3351 Datasheet(HTML) 174 Page - Texas Instruments |
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174 / 252 page ![]() 174 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 SPRS717J – OCTOBER 2011 – REVISED APRIL 2016 www.ti.com Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Peripheral Information and Timings Copyright © 2011–2016, Texas Instruments Incorporated 7.7.2.3.3.2 Compatible JEDEC DDR3 Devices Table 7-58 shows the parameters of the JEDEC DDR3 devices that are compatible with this interface. Table 7-58. Compatible JEDEC DDR3 Devices (Per Interface) NO. PARAMETER TEST CONDITIONS MIN MAX UNIT 1 JEDEC DDR3 device speed grade tC(DDR_CK) and tC(DDR_CKn) = 3.3 ns DDR3-800 tC(DDR_CK) and tC(DDR_CKn) = 2.5 ns DDR3-1600 2 JEDEC DDR3 device bit width x8 x16 bits 3 JEDEC DDR3 device count(1) 1 2 devices (1) For valid DDR3 device configurations and device counts, see Section 7.7.2.3.3.1, Figure 7-47, and Figure 7-49. 7.7.2.3.3.3 PCB Stackup The minimum stackup for routing the DDR3 interface is a four-layer stack up as shown in Table 7-59. Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance signal integrity and electromagnetic interference performance, or to reduce the size of the PCB footprint. Table 7-59. Minimum PCB Stackup(1) LAYER TYPE DESCRIPTION 1 Signal Top signal routing 2 Plane Ground 3 Plane Split Power Plane 4 Signal Bottom signal routing (1) All signals that have critical signal integrity requirements should be routed first on layer 1. It may not be possible to route all of these signals on layer 1, therefore requiring routing of some signals on layer 4. When this is done, the signal routes on layer 4 must not cross splits in the power plane. |
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