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TPS25940 Datasheet(PDF) 47 Page - Texas Instruments |
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TPS25940 Datasheet(HTML) 47 Page - Texas Instruments |
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47 / 50 page ![]() www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 20X 0.25 0.15 1.6 0.1 20X 0.45 0.35 0.8 MAX (0.2) TYP 0.05 0.00 16X 0.5 2X 2.5 2X 1.5 2.6 0.1 B 3.1 2.9 A 4.1 3.9 0.25 0.15 0.45 0.35 WQFN - 0.8 mm max height RVC0020A PLASTIC QUAD FLATPACK - NO LEAD 4219150/B 03/2017 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 6 11 16 7 10 20 17 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 21 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. SCALE 3.700 DETAIL OPTIONAL TERMINAL TYPICAL |
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