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LPC47M192 Datasheet(PDF) 138 Page - SMSC Corporation |
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LPC47M192 Datasheet(HTML) 138 Page - SMSC Corporation |
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138 / 228 page ![]() SMSC DS – LPC47M192 Page 138 Rev. 03/30/05 DATASHEET FIGURE 10 − SUGGESTED MINIMUM TRACK WIDTH AND SPACING 3. To reduce the effects of noise on the Dx+ and Dx- signals, a 2.2nF capacitor may be place between these two leads. Dx+ Dx- 2.2nF External Temperature Sensing Diode FIGURE 11 − USING A DIODE AS A REMOTE TEMPERATURE SENSING ELEMENT 4. Place 0.1uF (ceramic) bypass and 20uF (electrolytic or tantalum) capacitors in parallel between the power supply (HVCC) and ground. They should be kept as close to the hardware monitoring block as possible. |
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