GS3281 datasheet(4/97 Pages) SEMTECH

4 / 97 page

GS3281

Final Data Sheet

Rev.7

PDS-061453

January 2019

4 of 97

Semtech

Proprietary & Confidential

www.semtech.com

4.5.2 Matrix-Scan and Shape-Scan Operation ..................................................................... 29

4.6 PRBS Generator ................................................................................................................................ 35

4.7 Output Drivers .................................................................................................................................. 38

4.7.1 Bypassed Re-timer Signal Output Control ................................................................. 38

4.7.2 Output Driver Polarity Inversion.................................................................................... 38

4.7.3 Output Driver Data Rate Selection................................................................................ 39

4.7.4 Amplitude and Pre-Emphasis Control ......................................................................... 39

4.7.5 Output State Control Modes ........................................................................................... 41

4.8 GPIO Controls .................................................................................................................................... 43

4.9 GSPI Host Interface ......................................................................................................................... 43

4.9.1 CS Pin ....................................................................................................................................... 43

4.9.2 SDIN Pin .................................................................................................................................. 44

4.9.3 SDOUT Pin.............................................................................................................................. 44

4.9.4 SCLK Pin .................................................................................................................................. 45

4.9.5 Command Word 1 Description....................................................................................... 46

4.9.6 GSPI Transaction Timing...................................................................................................48

4.9.7 Single Read/Write Access ................................................................................................. 50

4.9.8 Auto-increment Read/Write Access ............................................................................. 51

4.9.9 Setting a Device Unit Address ........................................................................................ 52

4.9.10 Default GSPI Operation...................................................................................................53

4.9.11 Clear Sticky Counts Through Four Way Handshake............................................. 54

4.9.12 Device Power Up Sequence.......................................................................................... 54

4.9.13 Host Initiated Device Reset ........................................................................................... 55

5. Register Map................................................................................................................................................... 57

5.1 Control Registers ............................................................................................................................. 57

5.2 Status Registers ................................................................................................................................ 59

5.3 Register Descriptions ..................................................................................................................... 60

6. Application Information............................................................................................................................. 93

6.1 Typical Application Circuit ........................................................................................................... 93

7. Package & Ordering Information ............................................................................................................ 94

7.1 Package Dimensions ...................................................................................................................... 94

7.2 Recommended PCB Footprint .................................................................................................... 95

7.3 Packaging Data ................................................................................................................................ 95

7.4 Marking Diagram ............................................................................................................................. 96

7.5 Solder Reflow Profiles .................................................................................................................... 96

7.6 Ordering Information ..................................................................................................................... 96

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