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RX113 Datasheet(PDF) 121 Page - Renesas Technology Corp

Part # RX113
Description  32 MHz maximum operating frequency Capable of 50 DMIPS when operating at 32 MHz
PDF  131 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX113 Datasheet(HTML) 121 Page - Renesas Technology Corp

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R01DS0216EJ0120 Rev.1.20
Page 121 of 131
Sep 07, 2020
RX113 Group
5. Electrical Characteristics
Note:
Does not include the time until each operation of the flash memory is started after instructions are executed by software.
Note:
The lower-limit frequency of FCLK is 1 MHz during programming or erasing of the flash memory. When using FCLK at below
4 MHz, the frequency can be set to 1 MHz, 2 MHz, or 3 MHz. A non-integer frequency such as 1.5 MHz cannot be set.
Note:
The frequency accuracy of FCLK should be ±3.5%. Confirm the frequency accuracy of the clock source.
Table 5.62
ROM (Flash Memory for Code Storage) Characteristics (3)
Middle-speed operating mode Conditions: 1.8 V
≤ VCC ≤ 3.6 V, 1.8 V ≤ AVCC0 ≤ 3.6 V, VSS = AVSS0 = VSS_USB = 0 V
Temperature range for the programming/erasure operation: Ta = –40 to +85°C
Item
Symbol
FCLK = 1 MHz
FCLK = 8 MHz
Unit
Min.
Typ.
Max.
Min.
Typ.
Max.
Programming time
4-byte
tP4
—
143
1330
—
96.8
932
µs
Erasure time
1-Kbyte
tE1K
—
8.3
269
—
5.85
219
ms
256-Kbyte
tE256K
—
407
928
—
93
520
ms
Blank check time
4-byte
tBC4
——
78
——
50
µs
1-Kbyte
tBC1K
—
—
1.61
—
—
0.369
ms
Erase operation forcible stop time
tSED
—
—
33.6
—
—
25.6
µs
Start-up area switching setting time
tSAS
—
13.2
549
—
7.6
445
ms
Access window time
tAWS
—
13.2
549
—
7.6
445
ms
ROM mode transition wait time 1
tDIS
2—
—2—
—
µs
ROM mode transition wait time 2
tMS
3—
—3—
—
µs



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