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PCM1820 Datasheet(PDF) 6 Page - Texas Instruments |
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PCM1820 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 130 page ![]() 7.3 Recommended Operating Conditions MIN NOM MAX UNIT POWER AVDD, AREG(1) Analog supply voltage AVDD to AVSS (AREG is generated using onchip regulator): AVDD 3.3-V operation 3.0 3.3 3.6 V Analog supply voltage AVDD and AREG to AVSS (AREG internal regulator is shutdown): AVDD 1.8-V operation 1.7 1.8 1.9 IOVDD IO supply voltage to VSS (thermal pad): IOVDD 3.3-V operation 3.0 3.3 3.6 V IO supply voltage to VSS (thermal pad): IOVDD 1.8-V operation 1.65 1.8 1.95 INPUTS Analog input pins voltage to AVSS 0 AVDD V Digital input except IN2P_GPI1 and MICBIAS_GPI2 pins voltage to VSS (thermal pad) 0 IOVDD V Digital input IN2P_GPI1 and MICBIAS_GPI2 pins voltage to VSS (thermal pad) 0 AVDD V TEMPERATURE TA Operating ambient temperature –40 125 °C OTHERS GPIOx or GPIx (used as MCLK input) clock frequency 36.864 MHz Cb SCL and SDA bus capacitance for I2C interface supports standard-mode and fast- mode 400 pF SCL and SDA bus capacitance for I2C interface supports fast-mode plus 550 CL Digital output load capacitance 20 50 pF (1) AVSS and VSS (thermal pad): all ground pins must be tied together and must not differ in voltage by more than 0.2 V. 7.4 Thermal Information THERMAL METRIC(1) TLV320ADC6120 UNIT RTE (WQFN) 20 PINS RθJA Junction-to-ambient thermal resistance 55.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 33.1 °C/W RθJB Junction-to-board thermal resistance 23.4 °C/W ψJT Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 23.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 16.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. TLV320ADC6120 SBASA92A – DECEMBER 2020 – REVISED JUNE 2021 www.ti.com 6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TLV320ADC6120 |
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