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CP3BT13 Datasheet(PDF) 53 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # CP3BT13
Description  CP3BT13 Reprogrammable Connectivity Processor with Bluetooth-R and CAN Interfaces
PDF  232 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

CP3BT13 Datasheet(HTML) 53 Page - National Semiconductor (TI)

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11.1
EXTERNAL CRYSTAL NETWORK
An external crystal network is connected to the X1CKI and
X1CKO pins to generate the Main Clock, unless an external
clock signal is driven on the X1CKI pin. A similar external
crystal network may be used at pins X2CKI and X2CKO for
the Slow Clock. If an external crystal network is not used for
the Slow Clock, the Slow Clock is generated by dividing the
fast Main Clock.
The crystal network you choose may require external com-
ponents different from the ones specified in this datasheet.
In this case, consult with National’s engineers for the com-
ponent specifications
The crystals and other oscillator components must be
placed close to the X1CKI/X1CKO and X2CKI/X2CKO de-
vice input pins to keep the printed trace lengths to an abso-
lute minimum.
Figure 4 shows the required crystal network at X1CKI/
X1CKO and optional crystal network at X2CKI/X2CKO.
Table 23 shows the component specifications for the main
crystal network and Table 24 shows the component specifi-
cations for the 32.768 kHz crystal network.
Figure 4.
External Crystal Network
Choose capacitor component values in the tables to obtain
the specified load capacitance for the crystal when com-
bined with the parasitic capacitance of the trace, socket, and
package (which can vary from 0 to 8 pF). As a guideline, the
load capacitance is:
C2 > C1
C1 can be trimmed to obtain the desired load capacitance.
The start-up time of the 32.768 kHz oscillator can vary from
one to six seconds. The long start-up time is due to the high
Q value and high serial resistance of the crystal necessary
to minimize power consumption in Power Save mode.
11.2
MAIN CLOCK
The Main Clock is generated by the 12-MHz high-frequency
oscillator or driven by an external signal (typically the
LMX5252 RF chip). It can be stopped by the Power Man-
agement Module to reduce power consumption during peri-
ods of reduced activity. When the Main Clock is restarted, a
14-bit timer generates a Good Main Clock signal after a
start-up delay of 32,768 clock cycles. This signal is an indi-
cator that the high-frequency oscillator is stable.
C1
12 MHz/32.768 kHz
Crystal
C2
GND
X1CKI/X2CKI
X1CKO/X2CKO
DS007
Table 23
Component Values of the High Frequency Crystal Circuit
Component
Parameters
Values
Tolerance
Crystal
Resonance Frequency
Type
Max. Serial Resistance
Max. Shunt Capacitance
Load Capacitance
12 MHz ± 20 ppm
AT-Cut
50
Ω
7 pF
22 pF
N/A
Capacitor C1, C2
Capacitance
22 pF
20%
Table 24
Component Values of the Low Frequency Crystal Circuit
Component
Parameters
Values
Tolerance
Crystal
Resonance Frequency
Type
Maximum Serial Resistance
Maximum Shunt Capacitance
Load Capacitance
Min. Q factor
32.768 kHz
Parallel
N-Cut or XY-bar
40 k
Ω
2 pF
12.5 pF
40000
N/A
Capacitor C1, C2
Capacitance
25 pF
20%
CL
C1
C2
×
C1
C2
+
---------------------
Cparasitic
+
=



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