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TMP1827 Datasheet(PDF) 4 Page - Texas Instruments |
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TMP1827 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 68 page ![]() 6 Pin Configuration and Functions 6 8 7 5 3 ADDR SDQ IO3 GND 1 2 4 Thermal Pad V DD IO0 IO1 IO2/ALERT Figure 6-1. NGR 8-Pin WSON Top View Table 6-1. Pin Functions PIN I/O DESCRIPTION NAME WSON ADDR 3 I Resistor address select. If unused, TI recommends to connect pin to ground GND 4 — Ground IO0 6 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground IO1 7 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground IO2/ALERT 8 I/O General-purpose digital IO or configurable as temperature alert. If unused, TI recommends to connect pin to ground IO3 5 I/O General-purpose digital IO. If unused, TI recommends to connect pin to ground SDQ 2 I/O Serial bidirectional data. In bus power mode, the pin is used to power the internal capacitor VDD 1 I Supply voltage in VDD powered mode. In bus powered mode, must be connected to ground 7 Specifications 7.1 Absolute Maximum Ratings Over free-air temperature range unless otherwise noted(1) MIN MAX UNIT Supply voltage VDD 6.5 V I/O voltage SDQ, Bus powered mode –0.3 6.5 V SDQ, Supply powered mode –0.3 VDD + 0.3 I/O voltage IO0, IO1, IO2, IO3 –0.3 6.5 V I/O voltage ADDR –0.3 1.65 V Operating junction temperature, TJ –55 155 °C Storage temperature, Tstg –65 155 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) All pins ±500 V IEC 61000-4-2 Contact Discharge SDQ pin ±8000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. TMP1827 SBOSA15 – SEPTEMBER 2022 www.ti.com 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TMP1827 |
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