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ST25R3916 Datasheet(PDF) 25 Page - STMicroelectronics

Part # ST25R3916
Description  High performance NFC universal device and EMVCo™ reader
PDF  157 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST25R3916 Datasheet(HTML) 25 Page - STMicroelectronics

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DS12484 Rev 4
25/157
ST25R3916/7
Application information
156
The driver load modulation is based on the change of driver impedance. Typically, a high
impedance during non-modulated state and a lower impedance for the modulated state is
used. This yields modulation phase equal to passive tag modulation. It is also possible to
reverse the polarity of the driver load modulation by using low impedance during
non-modulated state and higher impedance for the modulated state.
During the non-modulated state the output impedance is defined by pt_res3:0 option bits.
During modulation the output impedance is defined by ptm_res3:0 option bits.
Load modulation through an external MOS transistor and a diode is selected by the lm_ext
option bit. In this case the EXT_LM pin is driven by the digital representation of the load
modulation signal (848 kHz subcarrier or 424 / 212 kHz modulation signal). The EXT_LM is
used to drive a gate of the external modulation MOS. The bit lm_ext_pol sets inverse
polarity for the external load modulation.
The pt_res3:0 and ptm_res3:0 bits must be set prior entering passive target mode (reg 03h),
because in passive target mode the resistance value propagates through the TX driver only
when the extracted clock is available.
Driver load modulation is based on change of the driver impedance. Typically high
impedance is used during non-modulated state, and decreased for modulated state,
resulting in modulation phase equal to Passive tag modulation.
It is also possible to set inverse polarity driver load modulation by using low impedance
during non-modulated state and higher impedance for the modulated state.
During non-modulated / modulated state the output impedance is defined, respectively, by
pt_res3:0 / ptm_res3:0 option bits.
An external MOS transistor and a diode modulation is selected by lm_ext option bit. In this
case the EXT_LM pin is driven by digital representation of the load modulation signal
(848 kHz subcarrier or 424 / 212 kHz modulation signal). The EXT_LM is used to drive a
gate of the external modulation MOS.
Bit lm_ext_pol sets inverse polarity for the External load modulation.
Bits pt_res<3:0> and ptm_res<3:0> must be set before entering Passive target mode (reg
03h), as in Passive target mode the resistance value propagates through the TX driver only
when extracted clock is available (during PT data transmission, including FDT).
Slow transmitter ramping
When the transmitter is enabled it starts to drive the antenna LC tank with full power, the
ramping of field emitted by antenna is defined by antenna LC tank Q factor.
However there are some reader systems where the reader field has to ramp up with a
longer transition time when it is enabled. The STIF (Syndicat des transports d'Ile de France)
specification requires a transition time from 10 to 90% of field longer than or equal to 10 μs.
The ST25R3916/7 supports slow transmitter ramping by collapsing VDD_RF regulated
voltage when transmitter is disabled and ramping it when transmitter is enabled. Typical
transition time is 15 μs at 3 V supply and 20 μs at 5 V supply.
Procedure to implement the slow transition:
1.
When transmitter is disabled set IO configuration register 2 bit slow_up to 1. Keep this
state at least 2ms to allow discharge of VDD_RF.
2.
Enable transmitter, its output will ramp slowly
3.
Before sending any command set the bit slow_up back to 0.



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