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ES9033 Datasheet(PDF) 100 Page - ESS Technology,Inc

Part # ES9033
Description  32-bit High-Performance 2-Channel DAC with Line Drivers
PDF  103 Pages
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Manufacturer  ESS [ESS Technology,Inc]
Direct Link  http://www.esstech.com
Logo ESS - ESS Technology,Inc

ES9033 Datasheet(HTML) 100 Page - ESS Technology,Inc

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ES9033 Datasheet Information
ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM
100
RPC-2 Pb-Free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3, <350
Volume mm3, 350 to 2000
Volume mm3, >2000
<1.6 mm
260°C
260°C
260°C
1.6 mm – 2.5 mm
260°C
250°C
245°C
>2.5 mm
250°C
245°C
245°C
Table 24 – Classification Temperatures
At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the
values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc).
Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes
reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.



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