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RF226AP Datasheet(PDF) 29 Page - NXP Semiconductors

Part # RF226AP
Description  RF112L0H Transceiver Data Sheet
PDF  46 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

RF226AP Datasheet(HTML) 29 Page - NXP Semiconductors

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Table 10. isolation between RF pins (continued)
TX1_M
B_OU
T
30
50
30
30
50
30
-
-
-
30
50
30
dB
TX1_H
B_OU
T
30
30
50
30
30
50
-
-
-
30
30
50
dB
TRX2:
TX
TX2_L
B_OU
T
50
30
30
50
30
30
50
30
30
-
-
-
dB
TX2_M
B_OU
T
30
50
30
30
50
30
30
50
30
-
-
-
dB
TX2_H
B_OU
T
30
30
50
30
30
50
30
30
50
-
-
-
dB
3.6 Frequency generation specification
Several LO-signals and clocks have to be generated independently in RF112L0H
Transceiver.
To retain the RF path coherence after power-up, all the synthesizers as well as all LO
dividers must be running all the time after power on. The frequency dividers must be able
to track the frequency while tuning, not missing any clock pulses, so that the mixer
phases will be the same when returning to the same frequency after a frequency change.
The TRX and the two observation receiver chains each require its own synthesizers. The
clocks used by the LVDS interfaces are generated internally in the LVDS IP and are
consequently not described here. An overview of the LO and clock generation
architecture is shown in the figure below.
Electrical characteristics
RF112L0H Transceiver Data Sheet, Rev. A, 12/2020
NXP Semiconductors
Preliminary
29
Confidential Proprietary



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