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RF226AP Datasheet(PDF) 42 Page - NXP Semiconductors |
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RF226AP Datasheet(HTML) 42 Page - NXP Semiconductors |
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42 / 46 page ![]() References Outline version European projection Issue date IEC JEDEC JEITA SOT804-4 - - - - - - - - - sot804-4_po 10-05-26 10-05-27 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 9.1 9.0 8.9 5.25 5.10 4.95 0.19 0.14 0.09 9.1 9.0 8.9 5.25 5.10 4.95 0.50 0.45 0.40 0.5 0.4 0.3 0.25 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-4 A1 b 0.30 0.21 0.18 c D(1) Dh Ds 0.1 0.05 0.05 v w y 0.1 y1 Dt 0.50 0.45 0.40 E(1) Eh Es 0.19 0.14 0.09 Et e 0.5 e1 7.5 e2 7.5 L L1 0.25 L2 0 2.5 5 mm scale terminal 1 index area B A D E C y C y1 X detail X A c A1 Dh Ds Dt Eh Es Et L L1 L2 b e2 e1 e e 1/2 e 1/2 e A C B v C w terminal 1 index area 17 32 64 49 48 33 1 16 Figure 25. Mechanical dimensions of the RF112L0H Package information RF112L0H Transceiver Data Sheet, Rev. A, 12/2020 42 Preliminary NXP Semiconductors Confidential Proprietary |
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