RF226AP datasheet(41/46 Pages) NXP

41 / 46 page

Table 16. Temperature sensor specification (continued)

Parameter

Conditions

Min

Typ

Max

Unit

50°C (571 mV)

606

LSB

27°C (531 mV)

-5

LSB

-40°C (414 mV)

-1786

LSB

Relative accuracy

Temperature

change..

±2

° C

4 Package information

4.1 Mechanical dimensions

The target package is a single row 64-pin extended lead QFN with 0.5mm pitch. This

table shows the package specification of the chip.

Table 17. Package specification

Parameter

Conditions

Minimum

Typical

Maximum

Unit

Number of pins

64 + Flag as

ground

Pin pitch

0.5

Thermal resistance Junction to case.

0.9

K/W

Junction to ambient

for a device

soldered in a 4-

layer 2S2P circuit

board with large

ground plane. No

forced air flow.

K/W

This figure shows the mechanical dimensions and bottom surface nomenclature of the

chip.

Package information

RF112L0H Transceiver Data Sheet, Rev. A, 12/2020

NXP Semiconductors

Preliminary

Confidential Proprietary

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