RF226AP datasheet(10/46 Pages) NXP

10 / 46 page

Table 2. Pinout list by bus (continued)

Signal

Signal description

Package

number

type

Power supply

Notes

TXBB2_IN_I_P

Base band I input positive

differential transmit signal

VDD_TRX2

TXBB2_IN_I_N

Base band I input negative

differential transmit signal

VDD_TRX2

TXBB2_IN_Q_N

Base band Q input negative

differential transmit signal

VDD_TRX2

Power

VDD_TRX1

Channel 1 transceiver supply

2, 4, 6,

11,13, 15

VDD_TRX2

Channel 2 transceiver supply

47, 45, 43,

38,36, 34

VDD_PROG

Programming supply

VDD_DIG_IO

Digital IO supply

VDD_DIG_CORE

Digital Core supply

VDD_SYNTH

Synthesizer supply

VDD_AUX

Aux supply

Ground

GND

Ground

1. The 65th pin serves as a ground and thermal pad

2. Application requires pull-down 10+/-1% KOhm resistor.

3. This pin can be left unconnected since they are configured as inputs with internal pull-down at reset.

4. In normal mode should be pulled to ground.

5. A 100 Ohms resistor should be placed between this pad and the other polarity pad.

3 Electrical characteristics

This section describes the DC and AC electrical specifications for the chip. The chip is

currently targeted to these specifications, some of which are independent of the I/O cell

but are included for a more complete reference. These are not purely I/O buffer design

specifications.

3.1 Overall DC electrical characteristics

This section describes the ratings, conditions, and other characteristics.

Electrical characteristics

RF112L0H Transceiver Data Sheet, Rev. A, 12/2020

Preliminary

NXP Semiconductors

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