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RF226AP Datasheet(PDF) 4 Page - NXP Semiconductors |
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RF226AP Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 46 page ![]() aaa-037116 BB RF HB LB TX_HB_LO_I I/Q I/Q TX_LB_LO_Q TX_LB_LO_I TX_HB_LO_Q BB RF HB LB RX2_HB_LO_I I/Q I/Q RX2_LB_LO_Q RX2_LB_LO_I RX2_HB_LO_Q BB RF RF HB LB HB RO1_HB_LO_I I/Q I/Q RO1_LB_LO_Q RO1_LB_LO_I RO1_HB_LO_Q BB RO2_HB_LO_I RO2_HB_LO_Q BB RF HB LB RX1_HB_LO_I RX1_LB_LO_Q RX1_LB_LO_I RX1_HB_LO_Q RO1 Path RO2 Path TX Path RX2 Path RX1 Path Figure 1. RF112L0H Transceiver Simplified model The RF112L0H Transceiver uses a direct conversion architecture for both RX and TX. The chip has independent synthesizers for each sub-system driven from a common reference. The frequency reference can be a 40 MHz crystal or external oscillator. The input reference is multiplied internally by 4 and can be routed to an output differential pair for use as a low jitter 160 MHz frequency reference by other devices in the system. The gain in receive mode should be controlled by the baseband IC. The receive chain has low noise and high dynamic range. The analog baseband filters have on-chip calibration and supports 20, 40, or 80 MHz modulation bandwidth. An internal crystal oscillator is implemented to enable usage of a low cost crystal. The reference frequency can be fine- tuned to minimize the frequency error. A LVDS clock output is included to provide a reference clock to the baseband chip. An auxiliary ADC is implemented for calibration purposes and to serve various external functions like power and temperature measurements. The two interfaces, a traditional low-speed I2C, and a low complexity high-speed custom LVDS buses are available for configuration and bi-directional data exchanges with the baseband. HS LLCP as main, LS I2C as secondary. The high speed interface can be used to provide a continuous stream of RF envelope detector samples after the LNA in each Introduction RF112L0H Transceiver Data Sheet, Rev. A, 12/2020 4 Preliminary NXP Semiconductors Confidential Proprietary |
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