33989 datasheet(62/66 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33989

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

INTRODUCTION

This thermal addendum is provided as a supplement to the MC33989 technical

datasheet. The addendum provides thermal performance information that may be

critical in the design and development of system applications. All electrical,

application, and packaging information is provided in the data sheet.

Packaging and Thermal Considerations

The MC33989 is offered in a 28 pin SOICW, single die package. There is a

single heat source (P), a single junction temperature (TJ), and thermal resistance

(RθJA).

The stated values are solely for a thermal performance comparison of one

package to another in a standardized environment. This methodology is not

meant to and will not predict the performance of a package in an application-

specific environment. Stated values were obtained by measurement and

simulation according to the standards listed below.

Standards

Figure 62. Surface Mount for SOIC Wide Body

non-Exposed Pad

28-PIN

SOICW

33989DWB

DWB SUFFIX

EG SUFFIX (PB-FREE)

98ASB42345B

28-PIN SOICW

Note For package dimensions, refer to

the 33989 device datasheet.

33989EG

RθJA

Table 36. Thermal Performance Comparison

Thermal Resistance

[

°C/W]

RθJA

(1) (2)

RθJB

(2) (3)

RθJA

(1) (4)

RθJC

(5)

220

Notes

Per JEDEC JESD51-2 at natural convection, still air

condition.

2s2p thermal test board per JEDEC JESD51-7.

Per JEDEC JESD51-8, with the board temperature on the

center trace near the center lead.

Single layer thermal test board per JEDEC JESD51-3.

Thermal resistance between the die junction and the

package top surface; cold plate attached to the package top

surface and remaining surfaces insulated.

28 Terminal SOICW

1.27 mm Pitch

18.0 mm x 7.5 mm Body

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