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33989 Datasheet(PDF) 65 Page - Freescale Semiconductor, Inc |
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33989 Datasheet(HTML) 65 Page - Freescale Semiconductor, Inc |
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65 / 66 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 65 33989 REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION OF CHANGES 4.91 7/2002 • Released XC33989: Motorola Format 5.0 8/2005 • Changed document to Freescale format • Added New Orderable Part Number • Maximum Rating Table; Added CANH, CANL and ESD ratings • Static Electrical Characteristics - Table 3 • POWER INPUT (VSUP): (ISUP(STOP2); Max rating changed from 410 to 210 µA) • POWER OUTPUT(VDD1): VDD1OUT Min rating changed from 4.0 to 4.75 V • Added CAN SUPPLY, CANH and CANL, TX and RX ratings • Dynamic Electrical Characteristics - Table 4 • STATE MACHINE TIMING (CS, SCLK, MOSI, MISO, WD, INT): CSFWU7 max rating changed from 248 to 128 ms • Added CAN MODULE-SIGNAL EDGE RISE AND FALL TIMES (CANH, CANL) ratings • Revised Application Section • Added supplemental Application Notes • Added Thermal Addendum 6.0 9/2005 • Cosmetic corrections • CS, INT and WD Pins were changed to CS, INT and WD 7.0 11/2005 • Published in error 8.0 11/2005 • Static Electrical Characteristics - Table 3, added new parameter “VDDst-cap” and Notes 14 and 16, corrected VDD1 output voltage VDD1OUT2 to minimum 4.0 V as previously published in revision 4.91. • Dynamic Electrical Characteristics - Table 4, Corrected Max Rating of 248 ms for Cyclic Sense/FWU Timing 7 CSFWU7 as previously published in revision 4.91 9.0 1/2006 • Dynamic Electrical Characteristics - Table 4,Corrected “Cyclic Sense ON Time” measurement “Unit” from ms to µs 10.0 6/2006 • Updated to the prevailing Freescale form and style • Updated from Advance Information to Final documentation • Removed PC33989EG/R2 and replaced with MCZ33989EG/R2 in the Ordering Information block 11.0 11/2006 • Replaced the label Logic Inputs with Logic Signals (RX, TX, MOSI, MISO, CS, SCLK, RST, WD, and INT) on page 4 • Replaced Logic Output Pins with LOGIC Input PINS (MOSI, SCLK, CS) on page 9 • Reviewed labeling for device pins VDD1, RST, INT, CS, VSUP, TX, RX, V2CTRL, V2, and WD throughout the data sheet, and made corrections as applicable. 12.0 12/2006 • Made changes to Supply Current in Standby Mode (10) (11) on page 6 and Supply Current in Normal Mode (10) on page 6 • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 4. Added note with instructions to obtain this information from www.freescale.com. 13.0 3/2007 • Added the EG suffix to the included thermal addendum |
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