Philips Semiconductors

Product specification

SC28L198

Octal UART for 3.3V and 5V supply voltage

1999 Jan 14

6

Pin Description

MNEMONIC

TYPE

DESCRIPTION

SClk

I

Host system clock. Used to time operations in the Host Interface and clock internal logic. Must be greater

than twice the frequency of highest X1, Counter/Timer, TxC (1x) or RxC (1x) input frequency.

CEN

I

Chip select: Active low. When asserted, allows I/O access to OCTART registers by host CPU. W_RN signal

indicates direction. (Must not be active in IACKN cycle)

A(7:0)

I

Address lines (A[6] is NOT used. See ”Host Interface” )

D(7:0)

I/O

8–bit bi–directional data bus. Carries command and status information between 28L198 and the host CPU.

Used to convey parallel data for serial I/O between the host CPU and the 28L198

W_RN

I

Write Read not control: When high indicates that the host CPU will write to a 28L198 register or transmit FIFO.

When low, indicates a read cycle. 0 = Read; 1 = Write

DACKN

O

Data Acknowledge: Active low. When asserted, it signals that the last transfer of the D lines is complete.

Open drain.

IRQN

O

Interrupt Request: Active low. When asserted, indicates that the 28L198 requires service for pending inter-

rupt(s). Open drain.

IACKN

I

Interrupt Acknowledge: Active low. When asserted, indicates that the host CPU has initiated an interrupt ac-

knowledge cycle. (Do not use CEN in an IACKN cycle)

TD(a–h)

O

Transmit Data: Serial outputs from the 8 UARTs.

RD(a–h)

I

Receive Data: Serial inputs to the 8 UARTs

I/O0(a–h)

I/O

Input/Output 0: Multi–use input or output pin for the UART.

I/O1(a–h)

I/O

Input/Output 1: Multi–use input or output pin for the UART.

I/O2(a–h)

I/O

Input/Output 2: Multi–use input or output pin for the UART.

I/O3(a–h)

I/O

Input/Output 3: Multi–use input or output pin for the UART.

I

Global general purpose inputs, available to any/all channels.

O

Global general purpose outputs, available from any channel.

RESETN

I

Master reset: Active Low. Must be asserted at power up and may be asserted at other times to reset and re-

start the system. See “Reset Conditions” at end of register map. Minimum width 10 SCLK.

X1/CCLK

I

Crystal 1 or Communication Clock: This pin may be connected to one side of a 2–8 MHz crystal. It may alter-

natively be driven by an external clock in this frequency range. Standard frequency = 3.6864 MHz

X2

O

Crystal 2: If a crystal is used, this is the connection to the second terminal. If a clock signal drives X1, this pin

must be left unconnected.

Power Supplies

I

8 pins total 6 pins for Vss, 2 pins for Vcc

NOTE: Many output pins will have very fast edges, especially when lightly loaded (less than 20 pf.) These edges may move as fast as 1 to 3 ns

fall or rise time. The user must be aware of the possible generation of ringing and reflections on improperly terminated interconnections. See

previous note on Sclk noise under pin assignments.

SYMBOL

PARAMETER

RATING

UNIT

TA

See Note 3

ºC

TSTG

Storage temperature range

–65 to +150

ºC

Vcc

–0.5 to +7.0

V

Vss

Voltage from any pin to Vss

–0.5 to Vcc + 0.5

V

PD

Package Power Dissipation (PLCC)

3.78

W

PD

Package Power Dissipation (LQFP)

2.08

W

Derate above 25 ºC (PLCC pkg.)

30

mW/ºC

Derate above 25ºC (LQFP pkg.)

17

mW/ºC

NOTES:

1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and

the functional operation of the device at these or any other conditions above those indicated in the Operation Section of this specification is

not implied.

2. For operating at elevated temperatures, the device must be derated based on +150C maximum junction temperature.

3. Parameters are valid over specified temperature range. See ordering information table for applicable temperature range and operating

supply range.

4. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static

charge.