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STPMIC25APQR Datasheet(PDF) 54 Page - STMicroelectronics

Part # STPMIC25APQR
Description  Highly integrated power management IC for microprocessor units
PDF  145 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPMIC25APQR Datasheet(HTML) 54 Page - STMicroelectronics

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Figure 18. Reset power-cycle sequence example
christophe belet
ST Microelectonics
POWER_DOWN
POWER_ON
RSTn
PMIC State
RANK1 (LDO1)
mask_reset
RANK3 (BUCK1/2)
RANK0 RANK5 RANK4 RANK3
RANK4 (LDO4)
RANK0 (BUCK6)
RST
Enable BUCK6
by I²C
CHECK&
LOAD
POWER_UP
RANK1 RANK2 RANK3
POWER_ON
RSTn asserted
by AP
RANK2 RANK1
RANK4 RANK5
RANK2 (BUCK4)
RSTn released
by PMIC
RSTn released
by AP
RST
(2)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(2)
7 ms ?
(1): RANK_DLY[1:0]
(2): RST_DLY[1:0]
For RANK_DLY and RST_DLY see Table 91
Settings related to the example in Figure 18:
LDO1 with mask_reset option set (LDOS_MRST_CR[LDO1_MRST] = 1), is not impacted by the reset power-
cycle.
BUCK1, BUCK2, BUCK4, and LDO4 are powered down and up at their respective ranks defined in the NVM.
BUCK6 is enabled by I2C. So, it is powered down first and not restarted (as not defined in the NVM to start).
mask_reset is valid once. It is cleared in the CHECK&LOAD state. So, it is cleared following a turn-OFF
condition, a VINPOR, and a RSTn assertion.
When RSTn is released by the application processor, the PMIC keeps RSTn asserted (the RSTn signal keeps
low) meaning that the application processor is kept in reset until the PMIC releases the RSTn signal.
5.4.8
Thermal protection
The PMIC implements a thermal protection to prevent overheating damage. PMIC junction temperature is
permanently monitored by an embedded thermal sensor.
The first level of thermal protection consists of an alarm sent by an interrupt to the application processor:
•
When Tj rises above the TWRN_Rise threshold, the PMIC generates an THW_RI interrupt
•
When Tj falls below the TWRN_Fall threshold, the PMIC generates an THW_FA interrupt
The application processor can manage to decrease the application activity load to decrease the application power
consumption. Alternatively, a second level of thermal protection may occur.
The second level of thermal protection consists of triggering a turn-OFF hard-fault condition:
•
When Tj rises above the TSHDN_Rise threshold, the PMIC generates a turn-OFF hard-fault condition, and
the thermal fail-safe counter is incremented (TSHDN_FLT_CNT ++):
–
If the thermal fail-safe counter reaches the maximum number of power cycles defined in the NVM
(TSHDN_FLT_CNT > TSHDN_FLT_CNT_MAX) then the PMIC goes into the FAIL_SAFE_LOCK
state.
–
Alternatively, when Tj falls below the TSHDN_Fall threshold and a tTSHDN_DLY delay ends, the PMIC
restarts.
See Section 5.4.5 for details about fail-safe counter management.
STPMIC25
Feature descriptions
DS14278 - Rev 3
page 54/145



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