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440EPX Datasheet(PDF) 20 Page - Applied Micro Circuits Corporation |
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440EPX Datasheet(HTML) 20 Page - Applied Micro Circuits Corporation |
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20 / 94 page ![]() 440EPx – PPC440EPx Embedded Processor Preliminary Data Sheet 20 AMCC Proprietary Revision 1.26 – October 15, 2007 Assembly Recommendations Profile Feature Sn-Pb Eutectic Assembly Pb Free Reflow Assemble Average ramp-up rate 3 °C/Second Max 3 °C/Second Max Preheat • Temperature Min • Temperature Max • Time (min to max) 100 °C 150 °C 60-120 Seconds 150 °C 180 °C 60-120 Seconds Time Maintained Above: • Temperature •Time 183 °C 60-150 Seconds 230 °C 30-50 Seconds Peak Temperature 225 +0/-5 °C 260 +5/-0 °C Time within 5 °C of Actual Peak Temperature 10-30 Seconds 10-20 Seconds Ramp-down Rate 6 °C/Second Max 6 °C/Second Max Time 25 °C to Peak Temperature 6 Minutes Max 8 Minutes Max Sn-Pb Eutectic Assembly Pb Free Reflow Assembly MSL Level 3 3 Solder Ball Metallurgy 63Sn/37Pb Sn/4Ag/05Cu Table 3. Recommended Reflow Soldering Profile Table 4. JEDEC Moisture Sensitivity Level and Ball Composition |
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