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440EPX Datasheet(PDF) 72 Page - Applied Micro Circuits Corporation |
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440EPX Datasheet(HTML) 72 Page - Applied Micro Circuits Corporation |
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72 / 94 page ![]() Thermal resistance values for the TE-PBGA package in a convection environment at 6.3W are as follows: Parameter Symbol Airflow ft/min (m/sec) Unit Notes 0 (0) 100 (0.51) 200 (1.02) 300 (1.53 400 (2.04) 500 (2.55) Junction-to-ambient thermal resistance without heat sink θ JA 13.1 11.7 10.9 10.5 10.3 10 °C/W 5 Junction-to-ambient thermal resistance with heat sink θ JA 11.1 8.2 7.2 6.8 6.6 6.3 °C/W 5, 6 Resistance Value Junction-to-case thermal resistance θ JC 3.5 °C/W 5 Junction-to-board thermal resistance θ JB 7.3 °C/W 5 Notes: 1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. 2. TA = TC − P×θCA, where TA is ambient temperature and P is power consumption. 3. TCMax = TJMax − P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption. 4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes. 5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4 layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package). 6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a 0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK. 440EPx – PPC440EPx Embedded Processor Preliminary Data Sheet 72 AMCC Proprietary Revision 1.26 – October 15, 2007 Thermal Management The following heat sink was used in the above thermal analysis: ALPHA LPD35-15B (35mm x 35mm x15mm) The heat sink is manufactured by: Alpha Novatech, Inc. (www.alphanovatech.com) 473 Sapena Court, #12 Santa Clara, CA 95054 Phone: 408-567-8082 Table 17. Package Thermal Specifications |
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