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7.3 Best Design Practices

Place at least one 1-μF ceramic capacitor as close as possible to the OUT pin of the regulator.

Do not place the output capacitor more than 10-mm away from the regulator.

Connect a 1-μF low equivalent series resistance (ESR) capacitor across the IN pin and GND input of the

regulator for improved transient performance.

Do not exceed the absolute maximum ratings.

7.4 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 2.2 V and 5.5 V. The input

voltage range provides adequate headroom for the device to have a regulated output. This input supply must be

well regulated. If the input supply is noisy, additional input capacitors with low ESR help improve the output noise

performance.

7.5 Layout

7.5.1 Layout Guidelines

To improve AC performance such as PSRR, output noise, and transient response, design the printed-circuit-

board (PCB) with ground plane connections for the VIN and VOUT capacitors. Furthermore, make sure the ground

plane is connected at the GND pin of the device. In addition, the ground connection for the bypass capacitor

must connect directly to the GND pin of the device.

7.5.1.1 Power Dissipation

Knowing the device power dissipation and proper sizing of the thermal plane that is connected to the tab or pad

is critical to avoiding thermal shutdown and to provide reliable operation.

Power dissipation of the device depends on input voltage and load conditions and can be calculated using

Equation 6:

OUT

(6)

Power dissipation can be minimized and greater efficiency can be achieved by using the lowest possible input

voltage necessary to achieve the required output voltage regulation.

On both the VSON (DRB) and WSON (DRV) packages, the primary conduction path for heat is through the

exposed pad to the printed circuit board (PCB). The pad can be connected to ground or left floating; however,

the pad must be attached to an appropriate amount of copper PCB area to make sure the device does not

overheat. On the SOT-223 (DCQ) package, the primary conduction path for heat is through the tab to the PCB.

That tab must be connected to ground. The maximum junction-to-ambient thermal resistance depends on the

maximum ambient temperature, maximum device junction temperature, and power dissipation of the device and

can be calculated using Equation 7:

125 C

(7)

Knowing the maximum RθJA, the minimum amount of PCB copper area needed for appropriate heat sinking can

be estimated using Figure 7-9.

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TPS737

SBVS067W – JANUARY 2006 – REVISED AUGUST 2025

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