TPS737 datasheet(25/50 Pages) TI2

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• TB is the PCB temperature measured 1-mm away from the device package on the PCB surface (as Figure

7-11 shows)

Note

Both TT and TB can be measured on actual application boards using a thermo-gun (an infrared

thermometer).

For more information about measuring TT and TB, see the Using New Thermal Metrics application note,

available for download at www.ti.com.

As Figure 7-10 shows, the new thermal metrics (ΨJT and ΨJB) have very little dependency on board size. That

is, using ΨJT or ΨJB with Equation 8 is a good way to estimate TJ by simply measuring TT or TB, regardless of

the application board size.

Board Copper Area (in )

DRV

DCQ

DRB

YJT

DRV

DCQ

DRB

YJB

Figure 7-10. ΨJT and ΨJB vs Board Size

For a more detailed discussion of why TI does not recommend using θJC(top) to determine thermal

characteristics, see the Using New Thermal Metrics application note, available for download at www.ti.com.

For further information, see the Semiconductor and IC Package Thermal Metrics application note, also available

on the TI website. Figure 7-11 shows the measuring points for DRB, DRV, and DCQ packages.

(a) Example DRB (SON) Package Measurement

(b) Example DRV (SON) Package Measurement

1mm

T on top

of IC

T on PCB

surface

T on top

of IC

T on PCB

surface

1mm

See note (1)

Power dissipation can limit operating range. Check the Thermal Information table.

Figure 7-11. Measuring Points for TT and TB

www.ti.com

TPS737

SBVS067W – JANUARY 2006 – REVISED AUGUST 2025

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