8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision V (May 2025) to Revision W (August 2025)

Page

• Added new silicon thermals for DRV (WSON) package.....................................................................................4

Changes from Revision U (September 2024) to Revision V (May 2025)

Page

• Updated DRB (VSON) for DRB0008A package outline..................................................................................... 4

• Changed VIN above 1.7 V to VEN above 1.7 V in Enable Pin and Shutdown section.......................................19

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TPS737

SBVS067W – JANUARY 2006 – REVISED AUGUST 2025

www.ti.com

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