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LPC3240 Datasheet(PDF) 52 Page - NXP Semiconductors |
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LPC3240 Datasheet(HTML) 52 Page - NXP Semiconductors |
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52 / 80 page ![]() LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.1 — 24 June 2014 52 of 80 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Applies to VDD_CORE pins. [3] Applies to pins VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC. [4] Applies to pins VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK, and VDD_PLLUSB. [5] Applies when using 1.8 V Mobile DDR or Mobile SDR SDRAM. [6] Applies when using 2.5 V DDR memory. [7] Applies when using 3.3 V SDR SDRAM and SRAM. [8] Specifies current on combined VDD_RTCx during normal chip operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and VDD_CORE, VDD_IOx at typical voltage. [9] Specifies current on combined VDD_RTCx during backup operation: VDD_RTC, VDD_CORE, VDD_OSC = 1.2 V and all other VDD_x at 0 V. [10] Referenced to the applicable VDD for the pin. [11] Including voltage on outputs in 3-state mode. [12] The applicable VDD voltage for the pin must be present. [13] 3-state outputs go into 3-state mode when the applicable VDD voltage for the pin is grounded. [14] Accounts for 100 mV voltage drop in all supply lines. [15] Allowed as long as the current limit does not exceed the maximum current allowed by the device. IIH HIGH-level input current VI = VDD; no pull-down [10] -- 1 A IOZ OFF-state output current VO = 0 V; VO =VDD; no pull-up/down [10] -- 1 A Ilatch I/O latch-up current (1.5V DD) < VI < (1.5VDD) [10] -- 100 mA Table 8. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit |
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