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LPC3240 Datasheet(PDF) 64 Page - NXP Semiconductors

Part # LPC3240
Description  16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface
PDF  80 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC3240 Datasheet(HTML) 64 Page - NXP Semiconductors

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LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2.1 — 24 June 2014
64 of 80
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
11.7 MLC NAND flash memory controller
[1]
THCLK = 1/HCLK
[2]
CEAD = bit field TCEA_DELAY[1:0] in register MLC_TIME_REG[25:24]
[3]
WL = bit field WR_LOW[3:0] in register MLC_TIME_REG[3:0]
[4]
WH = bit field WR_HIGH[3:0] in register MLC_TIME_REG[7:4]
[5]
RL = bit field RD_LOW[3:0] in register MLC_TIME_REG[11:8]
[6]
RH = bit field RD_HIGH [3:0] in register MLC_TIME_REG[15:12]
[7]
RHZ = bit field NAND_TA[2:0] in register MLC_TIME_REG[18:16]
[8]
BD = bit field BUSY_DELAY[4:0] in register MLC_TIME_REG[23:19]
Fig 14.
SD card pin interface timing
002aae441
MS_SCLK
MS_DIO[3:0](O)
MS_DIO[3:0] (I)
td(QV)
th(D)
tsu(D)
Tcy(clk)
th(Q)
MS_BS (O)
MS_BS (I)
Table 17.
Dynamic characteristics of the MLC NAND flash memory controller
Tamb = 40 C to +85 C.
Symbol
Parameter
Min
Typ
Max
Unit
tCELREL
CE LOW to RE LOW time
[1][2]
-THCLK  CEAD
-ns
tRC
RE cycle time
[1][5][6]
-THCLK  (RL + 1) + THCLK  (RH  RL)-
ns
tREH
RE HIGH hold time
[1][5][6]
-THCLK  (RH  RL)-
ns
tRHZ
RE HIGH to output high-impedance time [1][5][7]
-THCLK  (RH  RL) + THCLK  RHZ
-ns
tRP
RE pulse width
[1][5]
-THCLK  (RL + 1)
-
ns
tREHRBL
RE HIGH to R/B LOW time
[1][8]
-THCLK  BD
-ns
tWB
WE HIGH to R/B LOW time
[1][8]
-THCLK  BD
-ns
tWC
WE cycle time
[1][3][4]
-THCLK  (WL + 1) + THCLK  (WH  WL)-
ns
tWH
WE HIGH hold time
[1][3][4]
-THCLK  (WH  WL)-
ns
tWP
WE pulse width
[1][3]
-THCLK  (WL + 1)
-
ns



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