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LPC3240 Datasheet(PDF) 61 Page - NXP Semiconductors |
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LPC3240 Datasheet(HTML) 61 Page - NXP Semiconductors |
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61 / 80 page ![]() LPC3220_30_40_50 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2.1 — 24 June 2014 61 of 80 NXP Semiconductors LPC3220/30/40/50 16/32-bit ARM microcontrollers 11.4 DDR SDRAM controller [1] All values valid for EMC pads set to fast slew rate at 1.8 V unless otherwise specified (see SDRAMCLK_CTRL register in the LPC32x0 User manual). [2] CMD_DLY = COMMAND_DELAY bit field in SDRAMCLK_CTRL[18:14] register, see External Memory Controller (EMC) chapter in LPC32x0 User manual. [3] Applies to signals EMC_DQM[3:0], EMC_DYCS[1:0], EMC_RAS, EMC_CAS, EMC_WR, EMC_CKE[1:0]. [4] DQS_DELAY, see LPC32x0 User manual, External Memory Controller Chapter, Section 8 DDR DQS delay calibration for details on configuring this value. [5] Test conditions for measurements: Tamb = 40 C to +85 C; operating frequency range foper = 52 MHz to 133 MHz; EMC_DQM[3:0] and EMC_D[31:0] driving 2 inches of 50 characteristic impedance trace with 10 pF capacitive load; no external source series termination resistors used. EMC pads set to fast slew rate at 1.8 V or 2.5 V (see SDRAMCLK_CTRL register in the LPC32x0 User manual). Table 14. EMC DDR SDRAM memory interface dynamic characteristics[1] CL =25 pF, Tamb =25 C, unless otherwise specified. Symbol Parameter Conditions Min Typical Max Unit foper operating frequency - 104 133 MHz tCK clock cycle time 7.5 9.6 - ns tCL CK LOW-level width - 0.5 t CK -ns tCH CK HIGH-level width - 0.5 t CK -ns td(V)ctrl control valid delay time [2][3] - (CMD_DLY 0.25) + 1.5 - ns th(ctrl) control hold time [2][3] - (CMD_DLY 0.25) 1.5 - ns td(AV) address valid delay time [2] - (CMD_DLY 0.25) + 1.5 - ns th(A) address hold time [2] - (CMD_DLY 0.25) 1.5 - ns tsu(Q) data output set-up time EMC_D[31:0] and EMC_DQM[3:0] to EMC_DQS[1:0] out [5] 0.08 t CK 0.15 t CK 0.25 t CK ns th(Q) data output hold time EMC_D[31:0] and EMC_DQM[3:0] to EMC_DQS[1:0] out [5] 0.25 t CK 0.35 t CK 0.42 t CK ns tDQSH DQS HIGH time for WRITE command -0.5 t CK -ns tDQSL DQS LOW time for WRITE command -0.5 t CK -ns tDQSS WRITE command to first DQS latching transition time for DQS out - tCK + 0.7 - ns tDSS DQS falling edge to CK set-up time for DQS in - 0.5 t CK -ns tDSH DQS falling edge hold time from CK for DQS in - 0.5 t CK -ns td(DQS) DQS delay time for DQS in [4] -DQS_DELAY - ns tsu(D) data input set-up time - 0.3 - ns th(D) data input hold time - 0.5 - ns |
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