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LPC3240 Datasheet(PDF) 61 Page - NXP Semiconductors

Part # LPC3240
Description  16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface
PDF  80 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC3240 Datasheet(HTML) 61 Page - NXP Semiconductors

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LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 2.1 — 24 June 2014
61 of 80
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
11.4 DDR SDRAM controller
[1]
All values valid for EMC pads set to fast slew rate at 1.8 V unless otherwise specified (see SDRAMCLK_CTRL register in the LPC32x0
User manual).
[2]
CMD_DLY = COMMAND_DELAY bit field in SDRAMCLK_CTRL[18:14] register, see External Memory Controller (EMC) chapter in
LPC32x0 User manual.
[3]
Applies to signals EMC_DQM[3:0], EMC_DYCS[1:0], EMC_RAS, EMC_CAS, EMC_WR, EMC_CKE[1:0].
[4]
DQS_DELAY, see LPC32x0 User manual, External Memory Controller Chapter, Section 8 DDR DQS delay calibration for details on
configuring this value.
[5]
Test conditions for measurements: Tamb = 40 C to +85 C; operating frequency range foper = 52 MHz to 133 MHz; EMC_DQM[3:0] and
EMC_D[31:0] driving 2 inches of 50
 characteristic impedance trace with 10 pF capacitive load; no external source series termination
resistors used. EMC pads set to fast slew rate at 1.8 V or 2.5 V (see SDRAMCLK_CTRL register in the LPC32x0 User manual).
Table 14.
EMC DDR SDRAM memory interface dynamic characteristics[1]
CL =25 pF, Tamb =25 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typical
Max
Unit
foper
operating frequency
-
104
133
MHz
tCK
clock cycle time
7.5
9.6
-
ns
tCL
CK LOW-level width
-
0.5
 t
CK
-ns
tCH
CK HIGH-level width
-
0.5
 t
CK
-ns
td(V)ctrl
control valid delay time
[2][3]
-
(CMD_DLY
 0.25) + 1.5
-
ns
th(ctrl)
control hold time
[2][3]
-
(CMD_DLY
 0.25)  1.5
-
ns
td(AV)
address valid delay time
[2]
-
(CMD_DLY
 0.25) + 1.5
-
ns
th(A)
address hold time
[2]
-
(CMD_DLY
 0.25)  1.5
-
ns
tsu(Q)
data output set-up time
EMC_D[31:0]
and
EMC_DQM[3:0]
to
EMC_DQS[1:0]
out
[5]
0.08
 t
CK
0.15
 t
CK
0.25
 t
CK
ns
th(Q)
data output hold time
EMC_D[31:0]
and
EMC_DQM[3:0]
to
EMC_DQS[1:0]
out
[5]
0.25
 t
CK
0.35
 t
CK
0.42
 t
CK
ns
tDQSH
DQS HIGH time
for WRITE
command
-0.5
 t
CK
-ns
tDQSL
DQS LOW time
for WRITE
command
-0.5
 t
CK
-ns
tDQSS
WRITE command to first DQS latching
transition time
for DQS out
-
tCK + 0.7
-
ns
tDSS
DQS falling edge to CK set-up time
for DQS in
-
0.5
 t
CK
-ns
tDSH
DQS falling edge hold time from CK
for DQS in
-
0.5
 t
CK
-ns
td(DQS)
DQS delay time
for DQS in
[4]
-DQS_DELAY
-
ns
tsu(D)
data input set-up time
-
0.3
-
ns
th(D)
data input hold time
-
0.5
-
ns



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