Data Sheet

ADG714/ADG715

Rev. E | Page 9 of 21

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 6.

Parameter

Rating

VDD to VSS

7 V

VDD to GND

−0.3 V to +7 V

VSS to GND

+0.3 V to −3.5 V

Analog Inputs1

VSS −0.3 V to VDD +0.3 V or

30 mA, whichever occurs first

Digital Inputs1

–0.3 V to VDD +0.3 V or 30 mA,

whichever occurs first

Peak Current, Sx or Dx

100 mA (pulsed at 1 ms, 10%

duty cycle maximum)

Continuous Current, Sx or Dx

30 mA

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Lead Temperature, Soldering

(10 sec)

300°C

Infrared Reflow (20 sec)

235°C

1

Overvoltages at the DIN pin, Sx, or Dx are clamped by internal diodes. Limit

current to the given maximum ratings.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment.

Careful attention to PCB thermal design is required.

θJA is the natural convection, junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

RU-24

128

42

°C/W

CP-24-10

127.991

15.382

°C/W

1

Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD-51.

2

Thermal impedance simulated values are based on a cool plate location at

the top of the package and measured at the bottom of the exposed paddle

of the LFCSP.

ESD CAUTION