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DSPB56725AF Datasheet(PDF) 44 Page - Freescale Semiconductor, Inc |
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DSPB56725AF Datasheet(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 48 page ![]() Symphony™ DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 1 Freescale Semiconductor 44 Figure 35. 80-Pin Package Outline Drawing (continued) FIGURE NOTES: 1 Dimensioning and tolerancing per ASME Y.14.5M–1994. 2 Controlling dimension: millimeter. 3 Data plane H is located at the bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4 Datum E, F and to be determined at datum plane H. 5 Dimensions to be determined at seating plane C. 6 Dimensions do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions include mold mismatch and are determined at datum plane H. 7 Dimension does not include dambar protrusion Dambar protrusion shall not cause the lead width to exceed 0.46 mm. Minimum space between protrusion and adjacent lead or protrusion is 0.07mm. |
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