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XIO2001 Datasheet(PDF) 124 Page - Texas Instruments |
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XIO2001 Datasheet(HTML) 124 Page - Texas Instruments |
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124 / 131 page  7.9 PCI Bus Timing Requirements (1) 7.10 ZGU Thermal Characteristics (1) XIO2001 PCI Express™ to PCI Bus Translation Bridge SCPS212B – MAY 2009 – REVISED JULY 2009 www.ti.com over recommended operating conditions 33 MHz 66 MHz PARAMETER TEST CONDITION UNIT MIN MAX MIN MAX CL = 50 pF 11 CLK to shared signal valid propagation delay time CL = 30 pF 6 tpd ns CL = 50 pF 2 CLK to shared signal invalid propagation delay time CL = 30 pF 1 CL = 50 pF 2 tEnable time, high-impedance-to-active delay time tON ns from CLK CL = 30 pF 1 CL = 50 pF 28 Disable time, active-to-high-impedance delay time tOFF ns from CLK CL = 30 pF 14 Setup time on shared signals before CLK valid tsu 7 3 ns (rising edge) Hold time on shared signals after CLK valid (rising th 0 0 ns edge) (1) The PCI shared signals are AD31:0, C/BE[3:0], FRAME, TRDY, IRDY, STOP, IDSEL, DEVSEL, LOCK, SERIRQ, PAR, PERR, SERR, and CLKRUN. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT θ JA Low-K JEDEC test board, 1s (single signal layer), no air 85 flow Junction-to-free-air thermal °C/W resistance High-K JEDEC test board, 2s2p (double signal layer, 48.3 double buried power plane), no air flow θ JC Junction-to-case thermal resistance Cu cold plate measurement process 8.5 °C/W θ JB Junction-to-board thermal EIA/JESD 51-8 25.4 °C/W resistance ψ JT Junction-to-top of package EIA/JESD 51-2 0.5 °C/W ψ JB Junction-to-board EIA/JESD 51-6 24 °C/W TA XIO2001ZGU 0 70 Operating ambient temperature °C range XIO2001IZGU –40 85 TJ XIO2001ZGU 0 105 Virtual junction temperature °C XIO2001IZGU –40 105 (1) For more details, refer to TI application note IC Package Thermal Metrics (SPRA953). Electrical Characteristics 124 Submit Documentation Feedback |
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