ADS42LB49 datasheet(2/70 Pages) TI

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ADS42JB49

ADS42JB69

SLAS900C – OCTOBER 2012 – REVISED JULY 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

SPECIFIED TEMPERATURE RANGE

ADS42JB49(2)

QFN-64

RGC

–40°C to +85°C

ADS42JB69

QFN-64

RGC

–40°C to +85°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

(2)

Product preview device.

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

AVDD3V

–0.3 to 3.6

AVDD

–0.3 to 2.1

Supply voltage range

DRVDD

–0.3 to 2.1

IOVDD

–0.3 to 2.1

Voltage between AGND and DGND

–0.3 to 0.3

INAP, INBP, INAM, INBM

–0.3 to 3

CLKINP, CLKINM

–0.3 to minimum (2.1, AVDD + 0.3)

SYNC~P, SYNC~M

–0.3 to minimum (2.1, AVDD + 0.3)

Voltage applied to input pins

SYSREFP, SYSREFM

–0.3 to minimum (2.1, AVDD + 0.3)

SCLK, SEN, SDATA, RESET, PDN_GBL,

–0.3 to 3.9

CTRL1, CTRL2, STBY, MODE

Operating free-air, TA

–40 to +85

°C

Temperature range

Operating junction, TJ

+125

°C

Storage, Tstg

–65 to +150

°C

Electrostatic discharge (ESD) rating

Human body model (HBM)

THERMAL INFORMATION

ADS42JB49,

ADS42JB69

THERMAL METRIC(1)

UNITS

RGC (QFN)

64 PINS

θJA

Junction-to-ambient thermal resistance

22.9

θJCtop

Junction-to-case (top) thermal resistance

7.1

θJB

Junction-to-board thermal resistance

2.5

°C/W

ψJT

Junction-to-top characterization parameter

0.1

ψJB

Junction-to-board characterization parameter

2.5

θJCbot

Junction-to-case (bottom) thermal resistance

0.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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