10XSC425 datasheet(51/56 Pages) FREESCALE

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Analog Integrated Circuit Device Data



Freescale Semiconductor

10XSC425

Packaging

8.1

Soldering Information

The 10XSC425 was qualified in accordance with JEDEC standards J-STD-020C Pb-free reflow profile. The maximum peak

temperature during the soldering process should not exceed 260 °C for 40 seconds maximum duration.

8.2

Marking Information

The device is identified by the part number: 10XSC425.

Device markings indicate build information containing the week and year of manufacture. The date is coded with the last four

characters of the nine character build information code (e.g. “CTKAH0929”). The date is coded as four numerical digits where

the first two digits indicate the year and the last two digits indicate the week. For instance, the date code “1329” indicates the 29th

week of the year 2013.

8.3

Package Mechanical Dimensions

Package dimensions are provided in package drawings. To find the most current package outline drawing, go to

www.freescale.com and perform a keyword search for the drawing’s document number.

Table 25. Package Outline

Package

Suffix

Package Outline Drawing Number

32-Pin SOIC-EP

98ASA00368D

10XSC425 Datasheet(PDF) 51 Page - Freescale Semiconductor, Inc