10XSC425 datasheet(9/56 Pages) FREESCALE

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Analog Integrated Circuit Device Data



Freescale Semiconductor

10XSC425

Electrical Characteristics

4.1

Maximum Ratings

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Symbol

Ratings

Value

Unit

Notes

ELECTRICAL RATINGS

VPWR(SS)

VPWR Supply Voltage Range

• Load Dump at 25 °C (400 ms)

• Maximum Operating Voltage

• Reverse Battery

-18

VDD

VDD Supply Voltage Range

-0.3 to 5.5

VDIG

Input / Output Voltage

-0.3 to 5.5

(5)

VSO

SO and CSNS Output Voltage

-0.3 to VDD+0.3

IDIG

Digital Input/Output Current in Clamp Mode

100

µA

ICL(WAKE)

WAKE Input Clamp Current

2.5

ICL(CSNS)

CSNS Input Clamp Current

2.5

VHS[0:3]

HS [0:3] Voltage

• Positive

• Negative

-24

VPWR - VHS

High Side Breakdown Voltage

IHS[0:3]

Output Current

6.0

(2)

ECL[0:1]

HS[0,1] Output Clamp Energy using single pulse method

(3)

ECL[2:3]

HS[2,3] Output Clamp Energy using single pulse method

(3)

VESD1

VESD2

VESD3

VESD4

ESD Voltage (VPWR Pins 9 and 33 must be externally connected.)

• Human Body Model (HBM) for HS[0:3], VPWR and GND

• Human Body Model (HBM) for other pins

• Charge Device Model (CDM)

Corner Pins (1, 13, 19, 21)

All Other Pins (2-12, 14-18, 20, 22-24)

±8000

±2000

±750

±500

(4)

Notes

Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output

current using package thermal resistance is required.

Active clamp energy using single-pulse method (L = 2.0 mH, RL = 0 , VPWR = 14 V, TJ = 150 C initial).

Pins 9 and 33 must be externally connected. ESD testing is performed in accordance with the Human Body Model (HBM)

(CZAP = 100 pF, RZAP = 1500 ), the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model (CDM), Robotic

(CZAP = 4.0 pF).

Input / Output pins are: IN[0:3], RSTB, FSI, SI, SCLK, CSB, and FSB

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