28F008B3 datasheet(1/49 Pages) INTEL

Part #	28F008B3

Description	SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE

PDF	49 Pages

Scroll/Zoom	100%

Manufacturer	INTEL [Intel Corporation]

Direct Link	http://www.intel.com

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1 / 49 page

E

PRELIMINARY

May 1997

Order Number: 290605-001

n Flexible SmartVoltage Technology

 2.7V–3.6V Program/Erase

 2.7V–3.6V Read Operation

 12V VPP Fast Production

Programming

n 2.7V or 1.8V I/O Option

 Reduces Overall System Power

n Optimized Block Sizes

 Eight 8-Kbyte Blocks for Data,

Top or Bottom Locations

 Up to Thirty-One 64-Kbyte Blocks

for Code

n High Performance

 2.7V–3.6V: 120 ns Max Access Time

n Block Locking

 VCC-Level Control through WP#

n Low Power Consumption

 20 mA Maximum Read Current

n Absolute Hardware-Protection

 VPP = GND Option

 VCC Lockout Voltage

n Extended Temperature Operation

 –40°C to +85°C

n Supports Code plus Data Storage

 Optimized for FDI, Flash Data

Integrator Software

 Fast Program Suspend Capability

 Fast Erase Suspend Capability

n Extended Cycling Capability

 10,000 Block Erase Cycles

n Automated Byte Program and Block

Erase

 Command User Interface

 Status Registers

n SRAM-Compatible Write Interface

n Automatic Power Savings Feature

n Reset/Deep Power-Down

 1 µA ICCTypical

 Spurious Write Lockout

n Standard Surface Mount Packaging

 48-Ball

µBGA* Package

 40-Lead TSOP Package

n Footprint Upgradeable

 Upgradeable from 2-, 4- and 8-Mbit

Boot Block

n ETOX™ V (0.4 µ) Flash Technology

n x8-Only Input/Output Architecture

 For Space-Constrained 8-bit

Applications

The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-

rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability

(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been

added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and

interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.

Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,

monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide

products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this

product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp

SMART 3 ADVANCED BOOT BLOCK

BYTE-WIDE

8-MBIT (1024K x 8), 16-MBIT (2056K x 8)

FLASH MEMORY FAMILY

28F008B3, 28F016B3

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