UPD178016 datasheet(47/56 Pages) NEC

47 / 56 page

µPD178004, 178006, 178016, 178018

12. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended in the table below.

For detail of recommended soldering conditions, refer to the information document “Semiconductor Device

Mounting Technology Manual” (C10535E).

For soldering methods and conditions other than those recommended below, contact an NEC sales representa-

tive.

Table 12-1. Surface Mounting Type Soldering Conditions

µPD178004GC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD178006GC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD178016GC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD178018GC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

Package peak temperature: 235

°C, Duration: 30 sec. max. (at 210°C or above),

Number of times: Three times max.

Package peak temperature: 215

°C, Duration: 40 sec. max. (at 200°C or above),

Number of times: Three times max.

Solder bath temperature : 260

°C max., Duration : 10 sec. max., Number of times

: once, Preheating temperature : 120

°C max.

(package surface temperature)

Pin temperature: 300

°C max. Duration: 3 sec. max. (per pin row)

Infrared reflow

VPS

Wave soldering

Partial heating

IR35-00-3

VP15-00-3

WS60-00-1

—

Recommended

Condition Symbol

Soldering Conditions

Soldering Method

Caution Do not use different soldering method together (except for partial heating).

UPD178016 Datasheet(PDF) 47 Page - NEC